Multilayer pcb circuit panel gold immersion osp surface finish

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  • Description
  • PCB item

    Manufacture capacity

    Layer counts

    1-20L

    Base material

    FR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)

    Material Thickness(mm)

    0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2

    Max board size(mm)

    1200x400mm

    Board outline tolerance

    +-0.15mm

    Board thickness

    0.4mm-3.2mm

    Thickness tolerance

    +-8%

    Minimum line/space

    0.1mm

    Min annular ring

    0.1mm

    SMD Pitch

    0.3mm

    Hole

    Min hole size(mechanical)

    0.2mmm

    Min hole size(laser hole)

    0.1mm

    Hole size tol(+/-)

    PTH:+-0.075mm;NPTH:+-0.05mm

    Hole size tol

    +-0.075mm

    Plating

    HASL/LF HAL

    2.5um

    Immersion gold

    Nickel 3-7um Au:1-5u”

    Surface finish

    HAL,ENIG,Plated gold,immersion gold,OSP

    Copper

    Copper weight

    0.5-6oz

    Color

    Solder mask

    Green,blue,black,white,yellow,red,matt green,matt black,matt blue

    Silk screen

    White,black,blue,yellow

    Acceptable file format

    Gerber file,powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000

    Certificate

    ROSH,ISO9001,UL

  • Specification
  • Material: FR4 CEM1 CEM3 alumininum

    Copper Thickness: 0.5-6oz

    Max board size: 1200 x 400mm

    Surface finish: OPS HAL Leadfree HASL Immersion gold

    Certificate: ISO9001 Rohs UL IATF16949


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