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PCB item | Manufacture capacity |
Layer counts | 1-20L |
Base material | FR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B) |
Material Thickness(mm) | 0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2 |
Max board size(mm) | 1200x400mm |
Board outline tolerance | +-0.15mm |
Board thickness | 0.4mm-3.2mm |
Thickness tolerance | +-8% |
Minimum line/space | 0.1mm |
Min annular ring | 0.1mm |
SMD Pitch | 0.3mm |
Hole | |
Min hole size(mechanical) | 0.2mmm |
Min hole size(laser hole) | 0.1mm |
Hole size tol(+/-) | PTH:+-0.075mm;NPTH:+-0.05mm |
Hole size tol | +-0.075mm |
Plating | |
HASL/LF HAL | 2.5um |
Immersion gold | Nickel 3-7um Au:1-5u” |
Surface finish | HAL,ENIG,Plated gold,immersion gold,OSP |
Copper | |
Copper weight | 0.5-6oz |
Color | |
Solder mask | Green,blue,black,white,yellow,red,matt green,matt black,matt blue |
Silk screen | White,black,blue,yellow |
Acceptable file format | Gerber file,powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
Certificate | ROSH,ISO9001,UL |
Lead time for production orders:
Sample lead time | Mass production lead time | |
Single sided pcb | 1-3days | 4-7days |
Double sided pcb | 2-5 days | 7-10days |
Multilayer pcb | 7-8days | 10-15days |
Pcb and assembly | 8-15 | 15-20days |
United States
