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PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
PCB itemManufacture capacityLayer counts1-20LBase materialFR3,high-TG FR4,CEM3,aluminum,high frequency(Rogers,Taconic,Aron,PTFE,F4B)Material Thickness(mm)0.4,0.6,0.8,1.0,1.2,1.5,1.6,2.0,2.4,3.2Max board size(mm)1200x400mmBoard outline tolerance+-0.15mmBoard thickness0.4mm-3.2mmThickness tolerance+-8%Minimum line/space0.1mmMin annular ring0.1mmSMD Pitch0.3mmHole Min hole size(mechanical)0.2mmmMin hole size(laser hole)0.1mmHole size tol(+/-)PTH:+-0.075mm;NPTH:+-0.05mmHole size tol+-0.075mmPlating HASL/LF HAL2.5umImmersion goldNickel 3-7um Au:1-5u”Surface finishHAL,ENIG,Plated
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